Pinouts and Timing

Atari Microprocessor Game System

 

Atari Microprocessor Game System

Ceramic Package Bonding Diagram

Basic Die Type:   C10241   Wire Bond: 1.25 mil aluminium US
Die Size:   202 x 181   Die Attach Cavity: 240 sq.
Process Flow: X Standard   Die Attach Preform:  
    Process per      
Synertek   Ceramic package bonding diagram  

TIA Timing Characteristics

Characteristic Symbol Min Typ Max Unit
Osc. duty cycle TC/TCYC 45 50 55 %
Osc. cycle time TCYC 260 280   nsec
Osc. rise-fall times TRC - TFC     25
Ø0 (OSC÷3) delay T0     200
Ø0 rise-fall times TR0 - TF0     25
Ø2 (Data clock) delay T2     250
Luminance delay TOUT     100
Vert Sync delay TVS     100
Horizontal Sync delay THS     100
Wait for Sync delay TWS     100
Ready delay TRDY     100
R/!W lead time TLEAD 180    
Data bus lead time TDATA 300    
Addr-data hold time THOLD 10    
Ø2 rise-fall times TRF2     25
Read data lag time TDLAG     395

TIA 00-02 and Lum Timing

TIA Ø0 - Ø2 AND LUM TIMING

TIA Write Timing Chareristics

TIA WRITE TIMING CHARACTERISTICS

TIA Read Timing Chareristics

TIA READ TIMING CHARACTERISTICS

TIA Comp-Syn and Ready Timing

TIA COMP-SYN AND READY TIMING

RSYNC-RES00-H0-H02-SHB-02-00

RSYNC - RES0 - H0 - HØ2 - SHB - Ø2 - Ø0

TIA RSYNC and Blank and Ready Timing

TIA RSYNC AND BLANK AND READY TIMING

TIA Pinout

  gnd 1 - -TIA- - 40 i0 <--
  syn 2 39 i1 <--
  !rdy 3 38 i2 <--
  Ø0 4 37 i3 <->
  l1 5 36 i4 <->
  bl 6 35 i5 <->
  l2 7 34 d6 <->
  l0 8 33 d7 <->
  col 9 32 a0 ---
  del 10 31 a1 ---
  osc 11 30 a2 ---
  au0 12 29 a3 ---
  au1 13 28 a4 ---
<-> d0 14 27 a5 ---
<-> d1 15 26 Ø2 ---
<-> d2 16 25 r/!w ---
<-> d3 17 24 !cs0 -->
<-> d4 18 23 !cs1 -->
<-> d5 19 22 !cs2 -->
  Vcc 20 21 !cs3 -->

Contents | Previous